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MOTOROLA
Freescale Semiconductor, Inc.
Order Number: MPXAZ6115A Rev. 1, 06/2004
SEMICONDUCTOR TECHNICAL DATA
Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated
MPXAZ6115A MPXHZ6115A SERIES
INTEGRATED PRESSURE SENSOR 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 Volts Output SMALL OUTLINE PACKAGE
Freescale Semiconductor, Inc...
Motorola's MPXAZ6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXAZ6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * Resistant to High Humidity and Common Automotive Media * Improved Accuracy at High Temperature * 1.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller-Based Systems * Temperature Compensated from -40 to +125C * Durable Thermoplastic (PPS) Surface Mount Package Application Examples * Aviation Altimeters * Industrial Controls * Engine Control/Manifold Absolute Pressure (MAP) * Weather Station and Weather Reporting Devices
VS
MPXAZ6115A6U CASE 482-01
MPXAZ6115AC6U CASE 482A-01 PIN NUMBER
1 2 3 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
NOTE: Pins 1, 5, 6, 7, and 8 are internal
device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead.
SUPER SMALL OUTLINE PACKAGE
SENSING ELEMENT
THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1
GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY
Vout
MPXHZ6115A6U CASE 1317-04
PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXAZ6115AC6U CASE 1317A-03
(c) Motorola, Inc. 2004
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MPXAZ6115A MPXHZ6115A SERIES
Freescale Semiconductor, Inc.
MAXIMUM RATINGS(1)
Parametrics
Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Output Source Current @ Full Scale Output
(2) (2)
Symbol
Pmax Tstg TA Io + Io -
Value
400 -40 to +125 -40 to +125 0.5 -0.5
Units
kPa C C mAdc mAdc
Output Sink Current @ Minimum Pressure Offset
NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
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OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2.) Characteristic
Pressure Range Supply Voltage(1) Supply Current Minimum Pressure @ VS = 5.0 Volts Offset(2) (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C)
Symbol
POP VS Io Voff VFSO VFSS V/P
Min
15 4.75 0.133 4.633 4.433 -
Typ
5.0 6.0 0.200 4.700 4.500 45.9 1.0 20 0.25
Max
115 5.25 10 0.268 4.768 4.568 1.5 -
Unit
kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms ms %VFSS
Full Scale Output(3) @ VS = 5.0 Volts Full Scale Span(4) @ VS = 5.0 Volts Accuracy(5) Sensitivity Response Warm-Up Time(6) Time(7)
(8)
tR -
Offset Stability
NOTES: 1. Device is radiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXAZ6115A 2
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MPXAZ6115A MPXHZ6115A SERIES
GEL DIE COAT P1 WIRE BOND LEAD FRAME
DIE
STAINLESS STEEL CAP THERMOPLASTIC CASE 100 nF
+5.0 V
VS Pin 2 MPXAZ6115A Vout Pin 4 GND Pin 3 47 pF 51 K to ADC
ABSOLUTE ELEMENT SEALED VACUUM REFERENCE
DIE BOND
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Figure 2. Cross Sectional Diagram SOP (Not to Scale) Figure 2 illustrates the absolute sensing chip in the basic Small Outline chip carrier (Case 482).
Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 3 shows a typical application circuit (output source current operation).
5.0 4.5 4.0 OUTPUT (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Pressure (ref: to sealed vacuum) in kPa 0 MIN TRANSFER FUNCTION: MAX Vout = Vs* (.009*P-.095) Error VS = 5.0 Vdc TEMP = 0 to 85C
TYP
Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application.
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MPXAZ6115A 3
MPXAZ6115A MPXHZ6115A SERIES
Freescale Semiconductor, Inc.
Transfer Function (MPXAZ6115A)
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 0.25 Vdc
Temperature Error Band
MPXAZ6115A Series
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C Break Points Temp - 40 0 to 85 125 Multiplier 3 1 1.75
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Pressure Error Band
3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 -2.0 -3.0 Pressure Error (Max) 15 to 115 (kPa) 1.5 (kPa) 20 40 60 80 100 120 Pressure (in kPa) Error Limits for Pressure
ORDERING INFORMATION--SMALL OUTLINE PACKAGE Device Type
Basic Element Ported Element
Options
Absolute, Element Only Absolute, Element Only Absolute, Axial Port Absolute, Axial Port
Case No.
482 482 482A 482A
MPX Series Order No.
MPXAZ6115A6U MPXAZ6115A6T1 MPXAZ6115AC6U MPXAZ6115AC6T1
Packing Options
Rails Tape and Reel Rails Tape and Reel
Marking
MPXAZ6115A MPXAZ6115A MPXAZ6115A MPXAZ6115A
ORDERING INFORMATION--SUPER SMALL OUTLINE PACKAGE Device Type
Basic Element Ported Element
Options
Absolute, Element Only Absolute, Element Only Absolute, Axial Port Absolute, Axial Port
Case No.
1317 1317A 1317A 1317A
MPX Series Order No.
MPXHZ6115A6U MPXHZ6115A6T1 MPXHZ6115AC6U MPXHZ6115AC6T1
Packing Options
Rails Tape and Reel Rails Tape and Reel
Marking
MPXHZ6115A MPXHZ6115A MPXHZ6115A MPXHZ6115A
MPXAZ6115A 4
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SURFACE MOUNTING INFORMATION
MPXAZ6115A MPXHZ6115A SERIES
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.660 16.76
0.100 TYP 2.54
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0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
Figure 5. SOP Footprint (Case 482 and 482A) MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
0.050 1.27 TYP 0.150 3.81
0.387 9.83
0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm
Figure 6. SSOP Footprint (Case 1317 and 1317A)
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MPXAZ6115A 5
MPXAZ6115A MPXHZ6115A SERIES
Freescale Semiconductor, Inc.
SMALL OUTLINE PACKAGE DIMENSIONS
-A4 5
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41
S
N
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J K M
C
H -TPIN 1 IDENTIFIER SEATING PLANE
DIM A B C D G H J K M N S
CASE 482-01 ISSUE O
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A
MPXAZ6115A 6
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Freescale Semiconductor, Inc.
MPXAZ6115A MPXHZ6115A SERIES
SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C A B 0.420 0.400 0.050 0.025 0.300 0.280 3 0.019 5 0.014 0.004 M C A B
8X NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM.
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A
B 3
0.300 0.280
0.298 0.278
GAGE PLANE
.014
0.165 0.145 0.010 0.002 0.004 DETAIL D C
SEATING PLANE
0.038 0.048 DETAIL D
10 0
CASE 1317-04 ISSUE D
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MPXAZ6115A 7
MPXAZ6115A MPXHZ6115A SERIES
Freescale Semiconductor, Inc.
SUPER SMALL OUTLINE PACKAGE DIMENSIONS
2X
0.006 C A B 0.420 0.400 0.050 0.025 0.025 0.345 0.325
NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 55 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM.
8X
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0.018 0.014
M
5 CAB .014
GAGE PLANE
0.345 0.325
0.004
0.010 0.002
0.048 0.038 DETAIL E
10 0
O 0.130 O 0.110
0.200 0.180 0.390 0.370 3 0.300 0.280
0.004
SEATING PLANE
A DETAIL E
B 3
0.300 0.280 BOTTOM VIEW
C
CASE 1317A-03 ISSUE A
MPXAZ6115A 8
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NOTES
MPXAZ6115A MPXHZ6115A SERIES
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Motorola Sensor Device Data
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MPXAZ6115A 9
MPXAZ6115A MPXHZ6115A SERIES
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NOTES
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MPXAZ6115A 10
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NOTES
MPXAZ6115A MPXHZ6115A SERIES
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MPXAZ6115A 11
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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. (c) Motorola, Inc. 2004
HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center 3-20-1 Minami-Azabu. Minato-ku, Tokyo 106-8573, Japan 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors
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